LAM/Novellus^® Consumables and Repair Parts

Ion Implantation,- consumables and machine maintenance and support for

Concept^® 1, Concept^® 2 Altus^®, Sequel^®, Speed^®

Novellus^® provides semiconductor device manufacturers with advanced chemical vapor deposition (CVD) processing solutions that deliver productivity, the high film quality, and the low cost of ownership. The Company’s products are differentiated by their ability to provide simultaneous solutions to productivity and wafer quality problems facing the worldwide semiconductor manufacturing industry.

The Novellus^® Concept^® One is a plasma-enhanced chemical vapor deposition (PECVD) system used in semiconductor production to deposit various dielectric films on silicon wafers. These films include oxide, nitride, oxynitride, PSG, and TEOS oxide films. It is a CMOS-compatible tool, making it suitable for backend processes. The system can deposit thick films exceeding 1 µm and operates in a batch-type reactor, allowing deposition on multiple wafers in parallel. The Concept One model is designed for improved productivity and superior process performance, enabling more rapid and efficient fabrication of critical microelectronic components.

As technology nodes become ever smaller, there are challenges around scaling and integration in tungsten contact metallization processes. To meet the lower power consumption and high speed requirements of advanced devices, contact resistance must be minimized. Advanced memory and logic features require deposition techniques that enable complete, defect-free tungsten fill, while reducing resistivity of the bulk tungsten.

The Novellus/Lam^® ALTUS^® systems combine CVD and ALD technologies to deposit the highly conformal films needed for advanced tungsten metallization applications. Tungsten deposition is used for features that are small and often narrow, where a small amount of material will be used.

The Novellus/Lam^® Sequel^® chamber is a high-productivity PECVD chamber and offers a high flexibility in particular for dielectric stacks. So it requires also a high process stability. Every kind of process control should enable sensitive Fault Detection and Classification (FDC) as well as control of process mix impact.

Lam^® SPEED^® HDP-CVD products provide a multiple dielectric film solution for high-quality gapfill with industry-leading throughput and reliability. With advanced devices, the structures being filled can be very tall and narrow. As a result, high-quality dielectric films are especially important due to the ever increasing possibility of cross-talk and device failure.