Challenges in the Semiconductor Industry
While the semiconductor industry is always advancing to new technologies and larger wafers, fabs using mature process technologies continue to produce huge volumes of chips for a range of applications. Owners of existing 200mm fabs need solutions that enable them to make the most of their existing process technologies. Glemco is proud to contribute to these solutions with our robust product line offering high quality ion implantation consumables, as well as equipment repair and maintenance items.
Key Fab Challenges:
- Increase productivity
- Produce varying wafer sizes
- Accommodate a broad product mix
DRAM and NAND Flash Memory
To keep pace with exploding global demand, manufacturers of DRAM and NAND flash memory need to maximize productivity, while maintaining the highest levels of quality, consistency and reliability. Achieving these goals presents daunting challenges for their fab processes.
Key Fab Challenges:
- Produce high aspect ratio structures
- Maximize junction engineering scaling
- Manage multi-patterning issues
Low and High Voltage Power Device Semiconductors
Rapid growth in demand for both low- and high-voltage power device semiconductors, driven largely by the automotive and industrial sectors, has created supply challenges for chip manufacturers. To satisfy that demand, fabs need to maximize their yield and productivity, while meeting a range of technical challenges unique to power devices.
Key Fab Challenges:
- Deep wells for high-voltage devices
- Super-junction structures
- Abrupt junctions
- Silicon carbide doping challenges
- Aluminum implants at elevated temperatures
Mobile Electronic Device Semiconductors
As mobile electronic devices get smaller and smarter, manufacturers of advanced logic semiconductors must produce high-performance, sub-10nm logic chips in ever-increasing quantities. To compete effectively for lucrative advanced logic opportunities, manufacturers must overcome a number of technical challenges.
Key Fab Challenges:
- Reduce contact resistance
- Ensure defect-free epitaxy
- Minimize particle and metal contamination
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