Copper, Cu Material Information
Specifications
Physical Properties | Metric Temperature Ranges | English Temperature Ranges | Comments |
---|---|---|---|
Density | 7.764 g/cc @ 1300 °C | 0.2805 lb/in³ @ 2370 °F | |
Density | 7.846 g/cc @ 1200 °C | 0.2835 lb/in³ @ 2190 °F | |
Density | 7.924 g/cc @ 1100 °C | 0.2863 lb/in³ @ 2010 °F | |
Density | 7.94 g/cc @ 1083.6 °C | 0.287 lb/in³ @ 1982.5 °F | |
Density | 8.93 g/cc @ 20.0 °C | 0.323 lb/in³ @ 68.0 °F |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Hardness, Vickers | 50 | 50 | |
Tensile Strength, Ultimate | 210 Mpa | 30500 psi | |
Tensile Strength, Yield | 33.3 Mpa | 4830 psi | |
Elongation at Break | 60% | 60% | |
Modulus of Elasticity | 110 Gpa | 16000 ksi | |
Bulk Modulus | 140 Gpa | 20300 ksi | |
Poissons Ratio | 0.343 | 0.343 | |
Shear Modulus | 46.0 Gpa | 6670 ksi |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Electrical Resistivity | 0.00000170 ohm-cm | 0.00000170 ohm-cm | |
Magnetic Susceptibility | -8.00E-08 | -8.00E-08 | cgs/g |
Thermal Conductivity | 483 W/m-K @ -173 °C | 3350 BTU-in/hr-ft²-°F @ -279 °F | |
Thermal Conductivity | 10500 W/m-K @ -253 °C | 72900 BTU-in/hr-ft²-°F @ -423 °F | |
Thermal Conductivity | 19600 W/m-K @ -263 °C | 136000 BTU-in/hr-ft²-°F @ -441 °F | |
Melting Point | 1083.2 – 1083.6 °C | 1981.8 – 1982.5 °F | |
Boiling Point | 2562 °C | 4644 °F |
Thermal Properties | Metric Temperature Ranges | English Temperature Ranges | Comments |
---|---|---|---|
Heat of Fusion | 204.8 J/g | 88.10 BTU/lb | |
Heat of Vaporization | 5234 J/g | 2252 BTU/lb | |
CTE, Linear | 16.4 µm/m-°C @ 20.0-100°C | 9.11 µin/in-°F @ 68.0 – 212 °F | |
CTE, Linear | 18.5 µm/m-°C @ 250 °C | 10.3 µin/in-°F @ 482 °F | |
CTE, Linear | 20.2 µm/m-°C @ 500 °C | 11.2 µin/in-°F @ 932 °F | |
CTE, Linear | 24.8 µm/m-°C @ 925 °C | 13.8 µin/in-°F @ 1700 °F | |
Specific Heat Capacity | 0.385 J/g-°C | 0.0920 BTU/lb-°F | |
Thermal Conductivity | 385 W/m-K | 2670 BTU-in/hr-ft²-°F | |
Thermal Conductivity | 357 W/m-K @ 727 °C | 2480 BTU-in/hr-ft²-°F @ 1340 °F | |
Thermal Conductivity | 398 W/m-K @ 27.0 °C | 2760 BTU-in/hr-ft²-°F @ 80.6 °F | |
Thermal Conductivity | 401 W/m-K @ 0.000 °C | 2780 BTU-in/hr-ft²-°F @ 32.0 °F | |
Thermal Conductivity | 483 W/m-K @ -173 °C | 3350 BTU-in/hr-ft²-°F @ -279 °F | |
Thermal Conductivity | 10500 W/m-K @ -253 °C | 72900 BTU-in/hr-ft²-°F @ -423 °F | |
Thermal Conductivity | 19600 W/m-K @ -263 °C | 136000 BTU-in/hr-ft²-°F @ -441 °F | |
Melting Point | 1083.2 – 1083.6 °C | 1981.8 – 1982.5 °F | |
Boiling Point | 2562 °C | 4644 °F |
Chemical Properties | Metric | English | Comments |
---|---|---|---|
Atomic Mass | 65.546 | 65.546 | 1995 |
Atomic Number | 29 | 29 | |
Thermal Neutron Cross Section | 3.8 barns/atom | 3.8 barns/atom | |
X-Ray Absorption Edge | 1.38 Å | 1.38 Å | K |
X-Ray Absorption Edge | 11.269 Å | 11.269 Å | LI |
X-Ray Absorption Edge | 12.994 Å | 12.994 Å | LII |
X-Ray Absorption Edge | 13.2578 Å | 13.2578 Å | LIII |
Electrode Potential | -0.520 V | -0.520 V | Monovalent |
Electrode Potential | -0.340 V | -0.340 V | Divalent |
Electronegativity | 1.9 | 1.9 | Pauling |
Ionic Radius | 0.720 Å | 0.720 Å | Crystal Ionic Radius for Valence +2 |
Ionic Radius | 0.960 Å | 0.960 Å | Crystal Ionic Radius for Valence +1 |
Electrochemical Equivalent | 1.185 g/A/h | 1.185 g/A/h | Divalent |
Electrochemical Equivalent | 2.38 g/A/h | 2.38 g/A/h | Monovalent |
Emissivity (0-1) | 0.15 @ >=655 nm, Temperature 807 °C | 0.15 >=655 nm, Temperature 1480 °F | Polished |
Optical Properties | Metric In Wavelengths & Temperatures | English In Wavelengths & Temperatures | Comments |
---|---|---|---|
Emissivity (0-1) | 0.15 @ >=655 nm, Temperature 807 °C | 0.15 >=655 nm, Temperature 1480 °F | Polished |
Reflection Coefficient, Visible (0-1) | 0.63 | 0.63 |
NOTE: The information in this data sheet is for design guidance only. Forming methods and specific geometry could affect properties.
Overview
Copper has a melting point of 1083.4 +/- 0.2°C, boiling point of 2567°C, specific gravity of 8.96 (20°C), with a valence of 1 or 2. Copper is reddish colored and takes a bright metallic luster. It is malleable, ductile, and a good conductor of electricity and heat. It is second only to silver as an electrical conductor. It is non magnetic and non-sparking. Copper is also anti-bacterial and corrosion resistant make it ideal for hospitals, food preparation, brewing and plumbing systems. Data provided by Copper.org.
Applications & Usage
- Feed-Throughs
- EMI Shielding
- Seam Weld Electrodes
- Thermal Seals
- Electrical Contacts
- Cathode Connectors
- Water Pipes
- Radiators
- Cooking implements like saucepans, brewing vessels and heat exchangers
- Cell Phones
- Manufacturing wires and cables
Industries Using This Material
- Semiconductor
- Energy
- Food